| 摘要 |
PROBLEM TO BE SOLVED: To provide a support film for forming a ceramic green sheet with a wiring pattern, suppressing generation of delamination, printing a wiring pattern by conductor paste without printing blur, and achieving an excellent peel properties, and to provide a method of manufacturing a wiring substrate using the same, and the wiring substrate. SOLUTION: The support film 1 includes a solvent absorbing layer 13 formed on an upper surface of a support film body 11 through a release agent layer 12. The solvent absorbing layer contains thermoplastic resin and inorganic filler and absorbs a solvent which is not absorbed by the release agent layer 12. The ceramic green sheet with a wiring pattern is formed on an upper surface of the solvent absorbing layer 13. COPYRIGHT: (C)2011,JPO&INPIT |
