PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE FILM ADHESIVE, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT

摘要

A photosensitive adhesive composition that can form an adhesive layer on an adherend and allows an adhesive pattern to be formed by exposure treatment with radiation and developing treatment with a developing solution, the photosensitive adhesive composition having solubility and developability, and the film thickness T 1 (µm) of the adhesive pattern formed after development satisfying the conditions represented by the following expression (1). T 1 / T 0 × 100 ‰¥ 90
[In expression (1), T 0 represents the film thickness (µm) of the adhesive layer before developing treatment.]