| 摘要 |
PURPOSE: A heat emitting printed circuit board(PCB) integrated with the bracket for a backlight unit is provided to prevent the reduction of thermal conduction due to an air layer by reducing the generation of interface due to a thermal interface material. CONSTITUTION: A heat emitting PCB is divided into one circuit pattern part(270) and two curved region parts(280) based on two curved parts(290). The circuit pattern part includes a chip mounting part(250) and an electrode part. A light emitting element(260) is mounted at the chip mounting part. Electrode wiring parts(230, 240) are formed at the curved region parts in order to connect the chip mounting part and the electrode part.
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