| 摘要 |
A heat dissipating device includes a casing (1) having a compartment (11). At least one heat conducting board (2) is mounted in the compartment (11) and divides the compartment (11) into first and second chambers (111, 112). The first chamber (111) includes a plurality of openings. At least one fan unit (3) is mounted in the first chamber (111) and includes at least one air inlet (31) and at least one air outlet (32). The air inlet (31) is in communication with a first one of the plurality of openings (1111). The air outlet (32) is in communication with a second one of the plurality of openings (1112). By utilizing the heat conducting board (2) to absorb the heat generated by electronic elements (9) in the second chamber (112) and by creating airflow in the first chamber (111) with the fan unit (3), the temperature of the second chamber (112) and the electronic elements (9) is lowered while preventing moisture or dust from entering the first chamber (111). |
