An optoelectronic component includes a carrier with a mounting side and having at least one functional element, at least one substrateless optoelectronic semiconductor chip with a top and an opposed bottom and is electrically conductive by way of the top and the bottom, wherein the bottom faces the mounting side and the semiconductor chip is mounted on the mounting side, and at least one structured electrical contact film located on the top.
申请公布号
EP2319099(A2)
申请公布日期
2011.05.11
申请号
EP20090776063
申请日期
2009.08.04
申请人
OSRAM OPTO SEMICONDUCTORS GMBH
发明人
GUENTHER, EWALD, KARL, MICHAEL;HERRMANN, SIEGFRIED;ZEHNDER, ULRICH;BRUNNER, HERBERT