发明名称
摘要 <P>PROBLEM TO BE SOLVED: To solve a problem that bonding strength is insufficient between a printed board and a reflector or a lens and they are separated easily. <P>SOLUTION: In a light emitting diode where an LED chip 4 is mounted on a printed board 1 and a reflector 8 is bonded onto the printed board 1 mounting the LED chip 4, a part for enlarging the bonding area is formed on the bonding surface 6 of the printed board 1 and the reflector 8. The part for enlarging the bonding area is a hole 7 (groove, recess) formed in a part of the bonding surface 6 on the printed board 1. Alternatively, a rough surface is formed on the bonding surface of the reflector 8 and the LED chip 4 in addition to the hole 7. Adhesive 9 applied to the bonding surface 6 flows into the part for enlarging the bonding area thus increasing bonding strength between the printed board 1 and the reflector 8. Consequently, side pressure strength is enhanced and prevention of stripping can be expected at the time of falling of a product. It is also true in case of a lens instead of the reflector. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP4681343(B2) 申请公布日期 2011.05.11
申请号 JP20050130664 申请日期 2005.04.28
申请人 发明人
分类号 H01L33/48;H01L33/22;H01L33/58;H01L33/60;H01L33/62 主分类号 H01L33/48
代理机构 代理人
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