| 摘要 |
An arrangement (1, 31; 41) comprising at least one electronic power device (3), in particular a power transistor, and means for cooling the at least one power device (3), wherein the means comprise a separate metal face (6; 52) for each power device (3), is characterized in that the metal face (6; 52) is soldered to the respective power device (3). The inventive arrangement provides a cooling for an electronic power device that is simple and inexpensive to install, and offers a sufficient and reliable cooling capacity. |
