发明名称 HEAT RADIATING PRINTED CIRCUIT BOARD UNIFIED BRACKET FOR BACKLIGHT UNIT AND CHASSIS STRUCTURE HAVING THE SAME
摘要 PURPOSE: A heat emitting printed circuit board integrated with a bracket for a backlight unit and a chassis structure including the same are provided to prevent the separation phenomenon of a circuit pattern part due to the stress of an insulating layer. CONSTITUTION: A heat emitting printed circuit board integrated with a bracket is combined with the lateral side of a bottom chassis(230) using a combining unit(220). The heat emitting printed circuit board is composed of a circuit pattern part, two curved region parts, and two curved parts. A space part is arranged between the heat emitting printed circuit board and the lateral side of the bottom chassis.
申请公布号 KR20110048299(A) 申请公布日期 2011.05.11
申请号 KR20090105042 申请日期 2009.11.02
申请人 发明人
分类号 H05K7/20;G02F1/133 主分类号 H05K7/20
代理机构 代理人
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