发明名称 |
Printed circuit boards produced by assembling unit cells |
摘要 |
<p>A method of forming an interconnect substrate (30) includes providing at least two unit cells (100,102), arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern. A circuit substrate, has a desired circuit pattern on a substrate, the substrate made up of at least two unit cells having conductive lines electrically connected together.</p> |
申请公布号 |
EP2229042(A3) |
申请公布日期 |
2011.05.11 |
申请号 |
EP20100156255 |
申请日期 |
2010.03.11 |
申请人 |
PALO ALTO RESEARCH CENTER INCORPORATED |
发明人 |
LU, JENG PING;CHOW, EUGENE M |
分类号 |
H05K3/46;H05K1/14;H05K3/36 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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