| 摘要 |
Disclosed are embodiments of an electrically conductive fluid interconnect for coupling an integrated circuit (IC) device to a substrate. The IC device may be coupled to the substrate in a socketless manner or using a socket. The electrically conductive fluid interconnect may include, for example, a metal, an electrically conductive paste, or an electrically conductive polymer material. The fluid may be in a liquid or paste state over at least part of an operating temperature range of the IC device, and in other embodiments the fluid may be in the liquid or paste state at room temperature. Other embodiments are described and claimed.
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