发明名称 Dual gate structure, fabrication method for the same, semiconductor device having the same, and semiconductor device fabrication method
摘要 In one embodiment, a semiconductor device includes at least two stacked gate structures formed on a substrate. The two stacked gate structures each include a semiconductor layer and a metal layer over the semiconductor layer. The two stacked gate structures on the substrate are characterized by differential intermediate layers, one of the two structures including an ohmic layer and the other of the two structures not including an ohmic layer.
申请公布号 US7939401(B2) 申请公布日期 2011.05.10
申请号 US20090618044 申请日期 2009.11.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK HEESOOK;PARK JAEHWA;LEE JANGHEE;SEONG GEUMJUNG;LEE BYUNGHAK;LIM DONGCHAN;CHA TAEHO
分类号 H01L21/8238 主分类号 H01L21/8238
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