| 摘要 |
The invention relates to a multilayer structure such as a cover paper for a booklet, in particular a passport. The structure includes a radiofrequency identification device having a chip which is received in the thickness of the multilayer structure without generating extra thickness, the materials constituting the various layers of the multilayer structure are selected, as are the thicknesses of said layers, in such a manner that the cover withstands mechanical and thermal shocks, and in particular is capable of being subjected to graining treatment, and/or to decoration treatment by depositing a film by hot transfer under pressure, and/or to lamination treatment while depositing security films.
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