发明名称 Ventilated front-opening unified pod
摘要 An improved substrate transport pod for storing or transporting semiconductor wafer substrates during semiconductor wafer processing has a main body defined by a plurality of side panels. A substantial portion of at least one of the side panels being formed of a semi-permeable membrane allowing any corrosive gas molecules introduced to the interior of the pod to diffuse out of the transport pod through the semi-permeable membrane while preventing particulate contaminants from entering the transport pod.
申请公布号 US7938269(B2) 申请公布日期 2011.05.10
申请号 US20080268632 申请日期 2008.11.11
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 LIU HSIAO-CHYANG
分类号 B65D85/00 主分类号 B65D85/00
代理机构 代理人
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