发明名称 |
Ventilated front-opening unified pod |
摘要 |
An improved substrate transport pod for storing or transporting semiconductor wafer substrates during semiconductor wafer processing has a main body defined by a plurality of side panels. A substantial portion of at least one of the side panels being formed of a semi-permeable membrane allowing any corrosive gas molecules introduced to the interior of the pod to diffuse out of the transport pod through the semi-permeable membrane while preventing particulate contaminants from entering the transport pod.
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申请公布号 |
US7938269(B2) |
申请公布日期 |
2011.05.10 |
申请号 |
US20080268632 |
申请日期 |
2008.11.11 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LIU HSIAO-CHYANG |
分类号 |
B65D85/00 |
主分类号 |
B65D85/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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