| 摘要 |
PURPOSE: A substrate for a package and an electronic device package are provided to prevent the formation of a void trap by uniformly forming the flow speed of an under-fill regardless of the density of the bump. CONSTITUTION: A plurality of pads are formed on the surface of an insulator(110). An electronic device(210) is mounted on the surface of the insulator to be electrically connected to a plurality of pads through the bump. An under-fill unit(250) is injected between the electronic device and the insulator. The surface of the insulator has a first region and a second region which have different pad density. The surface roughness of the first region is different from the surface roughness of the second region.
|
