| 摘要 |
PURPOSE: A method for manufacturing a light emitting diode-based heat radiation substrate and a structure of the light emitting diode-based heat radiation substrate are provided to constantly maintain the progress direction of light by planarizing the protruded part of a heat radiation fin. CONSTITUTION: A printed circuit board(100) is prepared. An inserting hole(120) for inserting a heat radiation fin(200) into the specific part of a printed circuit board is formed. A soldering material film(140) is formed at one or more parts selected from the lower surface of the printed circuit board. The heat radiation fin is inserted into the inserting hole in order to be in contact with the soldering material film. The heat radiation fin is heated, and the contact part of the heat radiation fin and the printed circuit board is partially soldered. |
