| 摘要 |
PURPOSE: A device and a method for a cooper wire setting curing in a thin film lay-up progress are provided to efficiently perform the curing of a silver paste by setting a copper wire without using a capton tape. CONSTITUTION: In a device and a method for a cooper wire setting curing in a thin film lay-up progress, a copper wire setting device in a layup process sets a copper wire(30) in a cell glass(10). A silver paste dotting unit makes a sliver paste dotted in the cell glass. A copper wire transfer fixing unit transfers the copper wire to be set and fixed. A clamp block heating unit clamps the cell glass and the copper wire at the same time to perform curing. |
