摘要 |
PURPOSE: A substrate plating device is provided to prevent the waste of an electrolyte by receiving the electrolyte in a lower chamber with a small volume space. CONSTITUTION: A substrate driving unit(10) drives a substrate to which an cathode is applied. An upper chamber(20) provides a loading space(22) on which a substrate is loaded. A lower chamber is connected to the upper chamber and provides a plating space in which the substrate is plated. The substrate driving unit inputs and outputs the substrate plating surface to and from the upper chamber. The substrate driving unit inputs and outputs the substrate plating surface to and from the lower chamber by changing the horizontal substrate into the vertical substrate on the loading space.
|