发明名称 WAFER PLATING APPARATUS
摘要 PURPOSE: A substrate plating device is provided to prevent the waste of an electrolyte by receiving the electrolyte in a lower chamber with a small volume space. CONSTITUTION: A substrate driving unit(10) drives a substrate to which an cathode is applied. An upper chamber(20) provides a loading space(22) on which a substrate is loaded. A lower chamber is connected to the upper chamber and provides a plating space in which the substrate is plated. The substrate driving unit inputs and outputs the substrate plating surface to and from the upper chamber. The substrate driving unit inputs and outputs the substrate plating surface to and from the lower chamber by changing the horizontal substrate into the vertical substrate on the loading space.
申请公布号 KR20110047513(A) 申请公布日期 2011.05.09
申请号 KR20090104178 申请日期 2009.10.30
申请人 发明人
分类号 H01L21/208 主分类号 H01L21/208
代理机构 代理人
主权项
地址