| 摘要 |
PURPOSE: A method for manufacturing a printed circuit board with a bump is provided to prevent a low bump by reducing the height difference between the cross section of the bump on the printed circuit board and the adjacent bump. CONSTITUTION: A first circuit(115) is formed on the surface of a first carrier. A second circuit(125) is formed on the surface of a second carrier. The first carrier is compressed on one side of an insulation layer(130) to bury the first circuit. An etching resist is stacked on the first carrier corresponding to the area to form a bump(110'). The bump is formed by etching the first carrier.
|
