| 摘要 |
PURPOSE: A transfer device used in a thermal transfer process is provided to obtain a uniform surface contact between a device electrode and a common electrode, thereby preventing arc discharge between the device electrode and the common electrode. CONSTITUTION: A transfer substrate(101) and a substrate to be transferred are mounted in a vacuum chamber(100). The transfer substrate includes device electrode and a common electrode and common electrodes connected to the metal heat emitting pattern. Device electrodes are mounted on the common electrode. A pressurizing device(200) applies pressure to the device electrode and the common electrode. The pressurizing device includes a pressurizing pin(210).
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