| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for optical semiconductor element sealing use, excellent in crack resistance in undergoing soldering reflow and also excellent in temperature cycle reliability. <P>SOLUTION: The epoxy resin composition for optical semiconductor element sealing use includes (A) to (C) components described below; wherein the blend weight ratio [(A):(B)] is set at (60:40) to (95:5). The (A) component is a blend of (a1), (a2) and (a3), each of which has, in the main chain structure, a bisphenol and hexahydrophthalic acid; wherein (a1) is a specific monoepoxy compound, (a2) is a specific epoxy-free compound, and (a3) is a specific diepoxy compound. The (B) component is an epoxy compound other than the (A) component. The (C) component is a curing agent. <P>COPYRIGHT: (C)2011,JPO&INPIT |
