发明名称 |
SEMICONDUCTOR PACKAGE STRUCTURE HAVING MULTIPLE HEAT DISSIPATION PATHS AND METHOD OF MANUFACTURE |
摘要 |
In one embodiment, a semiconductor package structure includes a conductive bridge having coupling portions on opposing ends. A lead frame includes alignment or receiving features for receiving the coupling portions of the bridge. A semiconductor device is attached to both the conductive bridge and the lead frame, and is configured so that the coupling portions are on opposing sides of the semiconductor device. |
申请公布号 |
HK1118378(A1) |
申请公布日期 |
2011.05.06 |
申请号 |
HK20080109303 |
申请日期 |
2008.08.20 |
申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES L.L.C. |
发明人 |
STEPHEN ST. GERMAIN;PHILLIP CELAYA;ROGER ARBUTHNOT;FRANCIS J. CARNEY |
分类号 |
H01L |
主分类号 |
H01L |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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