| 摘要 |
PROBLEM TO BE SOLVED: To improve heat dissipation characteristics and conductive characteristics while suppressing an increase in the number of components and deterioration in production efficiency. SOLUTION: Through-holes 5 are formed at an insulated substrate 1 having a copper plate 3 formed on one surface. Conductive convex portions 9a are integrally formed on a copper plate 9 provided on the other surface of the insulated substrate 1. An adhesive sheet 15 is disposed between the insulated substrate 1 having the copper plate 3 and the copper plate 9, and a resulted product is heated and compression-bonded in a state that they are superimposed by using upper and lower jigs 17, 19 while press-fitting the convex portions 9a into the through-holes 15a of the adhesive sheet 15 and the through-holes 5 of the insulated substrate 1 (including the copper plate 3). COPYRIGHT: (C)2011,JPO&INPIT |
