TRENCH SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a trench substrate capable of achieving a fine and uniform circuit pattern by performing the processing so that the trenches have the same shape, and a method of manufacturing the same.

SOLUTION: This trench substrate 100a includes: a first insulation layer 120a formed with trenches 140; a second insulation layer 120b arranged under the first insulation layer 120a and low in laser processibility relative to that of the first insulation layer 120a; and a negative pattern 300 formed in the trenches 140.

COPYRIGHT: (C)2011,JPO&INPIT