| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which forms a UV-cure resin material wherein a satisfactory concave and convex pattern is transferred and hardened. SOLUTION: A semiconductor substrate and a transparent stamper are brought into contact with each other via a coating layer made of the uncured UV-cure resin material for pattern transfer containing an isobornyl acrylate, an acrylate which has a fluorene skeleton, a multifunctional acrylate, and a polymerization starter. Then, the coating layer made of the uncured UV-cure resin material is irradiated with UV to be hardened. COPYRIGHT: (C)2011,JPO&INPIT
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