PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to evenly remove the surface oxide film from a bump by preventing flux from flowing down from the bump. CONSTITUTION: In a printed circuit board and a manufacturing method thereof, a circuit pattern and a pad(120) are formed on the surface of an insulator(110). A solder resist(130) is coated on the top of the insulator. A bump(140') is formed on the top of the pad. A flux receiving part(141) of a recess shape is formed on the bump and efficiently removes an oxide film which is formed on the top of the bump.