| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a repeelable adhesive sheet that can be easily peeled while reducing warpage, cracking and edge chipping of a wafer, and an increase in adhesive power with temperature and/or contamination of an adherend during repeeling. <P>SOLUTION: The repeelable adhesive sheet includes a base and an adhesive layer laminated on a surface of the base, and is used for grinding the rear surface of a semiconductor wafer, wherein the repeelable adhesive has an elastic modulus of ≥10<SP>3</SP>MPa and a heating shrinkage of ≤1% at 60°C after a period of 10 minutes, and the adhesive layer is set to a thickness such that maximum point stress is ≤200 g/cm with a pressing amount of 30 μm from an adhesive layer side through a three-point bending test of the adhesive sheet. <P>COPYRIGHT: (C)2011,JPO&INPIT |
