METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SUBSTRATE FOR MOUNTING OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing an optical semiconductor device, the method effectively removing a resin burr without damaging a resin package and a lead frame.

SOLUTION: The method for manufacturing an optical semiconductor device includes the steps of: forming a light-reflecting layer 30 including a plurality of through-holes 30a formed by transfer molding using a thermosetting resin composition on a wiring member 10 and obtaining a molded article 70 including a plurality of recessed parts 32 formed therein, wherein each recessed part closes one opening of each through-hole 30a with the wiring member 10; chemically removing a resin burr 50 using a chemical where the resin burr is generated on a surface of the wiring member 10 and is made of a thermosetting resin composition; plating surfaces of conductive members 14a and 14b of the wiring member 10; arranging an optical semiconductor element 20 in each recessed part 32; feeding a sealing resin in each recessed part 32; curing the sealing resin; and obtaining a plurality of optical semiconductor devices 100 by dividing the molded article 70.

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