| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a one-pack epoxy resin composition excellent in workability, and to provide a method for producing a wafer-level chip size packaging device using the same as an insulation coating film layer. <P>SOLUTION: This invention relates to a one-pack epoxy resin composition comprising (A) a liquid epoxy resin having an ICI viscosity at 25°C of 15 Pa s or lower, (B) a solid aliphatic amine, (C) an inorganic filler of a maximum particle diameter of 75μm or smaller, and (D) carbon black, wherein component (C) is contained in an amount of 10-80 mass%. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
