| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module having a cooler for cooling a bare chip attached to the reverse surface side of a substrate, wherein cooling efficiency of the bare chip is increased while contact thermal resistance caused on both surfaces of an insulating member is suppressed as far as possible when the insulating member is provided between the substrate and cooler. SOLUTION: The substrate (12) of the power module (1) is composed of a multilayer substrate, and thermal vias (13) are provided partly to the multilayer substrate. COPYRIGHT: (C)2011,JPO&INPIT |
