发明名称 SUBSTRATE PROCESSING APPARATUS AND METHOD, AND THE SUBSTRATE PROCESSED BY THE METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and method, capable of controlling the pattern of a rugged structure to be formed on a surface of a substrate with high accuracy and avoiding waste of particles, and to provide the substrate processed by the method. <P>SOLUTION: The substrate processing apparatus 100 includes a carrier mechanism 40 and a transfer mechanism 50. The transfer mechanism 50 transfers fine particles 11 to the substrate 10 using an electrophotographic system. The transfer mechanism 50 includes a photosensitive drum 25, a transfer roller 28, a developing unit 60, a light source 23, a charger 24, a static eliminator 26 and a cleaning blade 27. The fine particles 11 are selectively attached to the photosensitive drum 25 by the transfer mechanism 50 to develop a latent image pattern and the attached fine particles 11 are transferred to the substrate 10. The position on the substrate 10 where the fine particles 11 attach is controlled with high accuracy. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011091261(A) 申请公布日期 2011.05.06
申请号 JP20090244535 申请日期 2009.10.23
申请人 ULVAC JAPAN LTD 发明人 SAKIO SUSUMU;IGUCHI SHINSUKE
分类号 H01L31/04 主分类号 H01L31/04
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