| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of processing substrate which does not leave a stained portion on a final workpiece, even if ion-implanted portion remains therein. <P>SOLUTION: The method of processing the substrate where the substrate is processed by dividing the same in a depth direction includes the steps of injecting protons from a main surface of the substrate S11; and irradiating to the substrate a light, having a wavelength substantially equal to the absorption wavelength of the defect level formed in the substrate by the proton injection so as to divide the substrate S12. <P>COPYRIGHT: (C)2011,JPO&INPIT |
