发明名称 CHIP RESISTOR TO BE BUILT IN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a chip resistor to be built in a substrate, which has a wide and flat electrode plane on a top surface, whose internal electrodes on the substrate top surface has the same structure as before, and which can obtain wide resistance characteristics and has improved mounting property. <P>SOLUTION: The chip resistor to be built in the substrate includes: the insulating substrate 11 having the top surface and a rear surface; a pair of internal electrodes 12a, 12b formed on the top surface of the substrate; a resistance film 13 formed between the pair of internal electrodes; protective films 17, 18 which is formed so as to cover at least a part of a region where the resistance film is formed and so as to partially expose the internal electrodes; and a pair of second internal electrodes 14a, 14b connected to exposed portions of the internal electrodes and formed so as to cover ends of the protective films, wherein the interval between the pair of second internal electrodes is narrower than the interval between the pair of internal electrodes 12a, 12b. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011091140(A) 申请公布日期 2011.05.06
申请号 JP20090242203 申请日期 2009.10.21
申请人 KOA CORP 发明人 ARIGA KATSUMI;KARASAWA HIDEKAZU
分类号 H01C7/00;H01C1/14;H01C17/02;H01C17/24;H01C17/28;H05K3/46 主分类号 H01C7/00
代理机构 代理人
主权项
地址