| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device with an adhesive sheet whose steps are not made complicated and which neither breaks the semiconductor device nor generates a defect in post-steps. SOLUTION: The method of manufacturing the semiconductor device having the adhesive sheet arranged on a reverse surface includes a step of forming V grooves on a top surface side of a semiconductor wafer along predetermined division lines of the semiconductor wafer; a step of arranging a protective member on the top surface side of the semiconductor wafer having the V groove formed; a step of grinding the reverse surface side of the semiconductor wafer until the semiconductor wafer has a prescribed thickness; an adhesive sheet and expand sheet sticking step of sticking the adhesive sheet and an expand sheet on the reverse surface side of the ground semiconductor wafer in order; and a dividing step of dividing the semiconductor wafer and adhesive sheet into individual semiconductor devices along the predetermined division lines from V vertexes of the V grooves as starting points by expanding the expand sheet after removing the protective member from the top surface of the semiconductor wafer. COPYRIGHT: (C)2011,JPO&INPIT |
