| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of operating a semiconductor manufacturing apparatus in which a periodical cleaning of a clamp mechanism is unnecessary. SOLUTION: The method of operating a semiconductor manufacturing apparatus which is a method of operating the semiconductor manufacturing apparatus for subjecting the surface of a substrate to a plating treatment includes: a process of retaining the substrate in a clamp mechanism; a process of lowering the clamp mechanism and immersing the surface of the substrate in the plating liquid in a treatment tank; a process of rotating the clamp mechanism with a rotation mechanism and subjecting the substrate to the plating treatment; a process of injecting washing liquid to the substrate subjected to the plating treatment by means of a first washing liquid injection part; a process of injecting washing liquid to the clamp mechanism in the direction reverse to the rotation direction of the clamp mechanism by means of a second washing liquid injection part; and a process of ejecting inactive gas to the clamp mechanism with an inactive gas ejection part. COPYRIGHT: (C)2011,JPO&INPIT
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