| 摘要 |
PROBLEM TO BE SOLVED: To achieve a prober allowing simultaneous probe-inspection of all chips on a wafer without applying a large pressure onto a Z-axis of a wafer chuck in probe-inspecting them sheet by sheet. SOLUTION: The prober for connecting each terminal of a tester with an electrode pad of a semiconductor device formed on the wafer includes a probe card holder 23 for holding a flexible probe card 50 having a plurality of protruded probes 53, the wafer chuck 16, sealing mechanisms 56, 57 sealing an inner space between the flexible probe card and the wafer chuck, and pressure adjusting mechanisms 61-63 for changing the pressure in the inner space sealed by the sealing mechanisms. The pressure in the inner space is reduced to press the flexible probe card against the wafer W by a difference in pressure between the inner space of the flexible probe card and a space on the opposite side. COPYRIGHT: (C)2011,JPO&INPIT
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