发明名称 MULTILAYER WIRING AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a multilayer wiring in which the amount of currents of each current path reaching an output terminal from an input terminal is equalized regardless of the resistance value of an object of connection. SOLUTION: A multilayer wiring 10 includes a plurality of wiring layers 12a, 12b, 14 and a plurality of contacts 11a-11d, 13a, 13b, 15 electrically connected to the plurality of wiring layers 12a, 12b, 14. The plurality of contacts connected to one side of each wiring layer are arranged at equal intervals in each wiring layer. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011091178(A) 申请公布日期 2011.05.06
申请号 JP20090242966 申请日期 2009.10.22
申请人 RENESAS ELECTRONICS CORP 发明人 NAGASE HIROKAZU
分类号 H01L21/822;H01L21/768;H01L21/82;H01L27/04;H01L29/78 主分类号 H01L21/822
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