| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator having an insulating resin in a gap between the other main surface of a substrate portion of an element mounting member and an integrated circuit element that prevents separation from an integrated circuit element mounting pad and inclination of a piezoelectric oscillator; and to provide a method for manufacturing the piezoelectric oscillator to improve productivity. SOLUTION: The piezoelectric oscillator includes: an element mounting member having a pair of two piezoelectric vibration element mounting pads formed on one main surface and the integrated circuit element mounting pad formed on the other main surface; piezoelectric vibration elements mounted on the piezoelectric vibration element mounting pad; an integrated circuit element mounted on the integrated circuit element mounting pads; and a lid member for hermetically sealing the piezoelectric vibration elements. In the piezoelectric oscillator, the integrated circuit element is equipped with a through hole. An insulating resin is formed in the gap between the other main surface of the element mounting member and the integrated circuit element and in the through hole. COPYRIGHT: (C)2011,JPO&INPIT
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