| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an insulating sheet which has an excellent thermal conductivity and is superior in insulating reliability, and to provide a process for production of a board. <P>SOLUTION: This is the insulating sheet in which a resin composition having an epoxy resin, a curing agent, and an inorganic filler are made into a sheet form. Either one or both of the epoxy resin and the curing agent has a naphthalene structure, and the inorganic filler contains hexagonal boron nitride and occupies 70-85 volume% of the total resin composition. It is desirable that the inorganic filler is made of coarse powder of which the average particle size is 10-400 μm and fine powder of which the average particle size is 0.5-4.0 μm. It is desirable that the insulating sheet is in B stage state or C stage state. The resin composition 3 is formed into the insulating sheet 6 half-cured in thin film shape by using a roll press in which it is passed through an upper roll 1 and a lower roll 2 while pinched by a lower support film 4 and an upper support film 5. <P>COPYRIGHT: (C)2011,JPO&INPIT |
