| 摘要 |
A surface acoustic wave device includes first interconnections and second interconnections connected to a potential different from a potential connected to the first interconnections that are arranged on a piezoelectric substrate. The first interconnections three-dimensionally intersect with the second interconnections with insulating layers made of a thermosetting resin, disposed therebetween. Interdigital electrodes defining IDTs are films which have six-fold rotational symmetric spots appearing in an XRD pole figure and which are defined by Al films or Al—Cu alloy films containing Cu in an amount not greater than the solubility limit at about 25° C.
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