RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE RESIN COMPOSITION

摘要

Disclosed is a resin composition for semiconductor encapsulation which contains: a phenol resin (A), an epoxy resin (B), and an inorganic filler (C). The resin composition for semiconductor encapsulation is characterised in that the phenol resin (A) contains a polymer (a1) having a structure represented by general formula (1), and in that the epoxy resin (B) contains at least one kind of epoxy resin selected from among: a triphenylmethane epoxy resin, a naphthol epoxy resin, and a dihydroanthracene epoxy resin. Further disclosed is a semiconductor device obtained by encapsulating a semiconductor element with the hardened form of the resin composition for semiconductor encapsulation.