| 摘要 |
The method involves inserting chip module (3) in a receiving position (6) of a substrate (1), where chip module has a contact surface (4.1,4.2). A contacting terminal is formed from a conducting wire (5) supplied by a wire guiding unit. A section (7) of the wire is fixed, outside the receiving position, on the surface of the substrate. The other section (8) adjacent to the former section is guided, in such a manner that the terminal is formed, where the section is bent and electrically connected with the surface. The third section (9) is fixed on the surface, outside the receiving position. An independent claim is also included for a device for producing a chip card. |
