CURABLE RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ENCAPSULATION, AND CURED PRODUCT OF SAME

摘要

Disclosed is a curable resin composition for optical semiconductor encapsulation which contains: a multi-functional biphenyl novolac epoxy resin component (A); a bisphenol epoxy resin (B) having an epoxy equivalent weight of 500-800g/eq; a bisphenol epoxy resin (C) having an epoxy equivalent weight of 850-1500g/eq; a multi-functional anhydride curing component (D); a phenol curing component (E) having a biphenyl skeleton or an alicyclic skeleton; and a (meth)acrylate component (F) having a phosphoric acid group. During transfer molding the resin composition exhibits excellent reactivity, has a short gel time, and does not include voids; under the high temperatures during mold removal, the resin composition exhibits excellent hardness, and has excellent gate-break properties. Additionally the encapsulated optical semiconductor element which can be obtained using the composition exhibits excellent re-flow properties.