发明名称 Reduction of Dielectric Losses Through Use of Organoclay in Semiconductor or Insulator Compositions
摘要 Organodavs are added to semiconductive compositions to provide a reduction in the dielectric losses of layered composites in which the semiconductive layer contains species which could migrate into the insulation and result in undesirably high dielectric losses, The invention semiconductive compositions provide improved performance in power cable applications.
申请公布号 US2011100675(A1) 申请公布日期 2011.05.05
申请号 US20080741116 申请日期 2008.10.15
申请人 PERSON TIMOTHY J;EATON ROBERT F 发明人 PERSON TIMOTHY J.;EATON ROBERT F.
分类号 H01B3/30;C08K5/17 主分类号 H01B3/30
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