发明名称 |
Method of manufacturing capacitor-embedded PCB |
摘要 |
A method of manufacturing a capacitor-embedded printed circuit board that includes fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.
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申请公布号 |
US2011099779(A1) |
申请公布日期 |
2011.05.05 |
申请号 |
US20110929234 |
申请日期 |
2011.01.10 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM WOON-CHUN;YI SUNG;PARK HWA-SUN;KIM HONG-WON;KIM DAE-JUN;PARK JIN-SEON |
分类号 |
H01G7/00 |
主分类号 |
H01G7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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