| 摘要 |
A lamp package (10) includes a leadframe (20). At least one light emitting diode (12) is mechanically and electrically coupled to the leadframe (20). At least one electronic component (14) is also mechanically and electrically coupled to the leadframe (20) and electrically coupled to the light emitting diode (12), the electronic component (14) controlling the supply of electrical power to the light emitting diode (12). At least one interconnect (16) is electrically coupled to the leadframe (20). A formed structure (26) is joined to the leadframe (20), the formed structure (26) enclosing at least a portion of the leadframe (20). |
