Halbleiterbauelement

摘要

In inlets used for ID tags and the like, a defective connection between an integrated circuit part (4) and an antenna (3) is suppressed by improvement of tolerance for a bending or a pressing pressure. The integrated circuit part includes a semiconductor chip (5) and a multilayer substrate (6,12) having a concave portion (7). The semiconductor chip (5) is mounted on the bottom of the concave portion (7). The multilayer substrate (6,12) includes a connection electrode (15) at the top surface and a connection electrode (23) connected to the semiconductor chip (5) on the bottom of the concave portion (7). The connection electrode (23) on the bottom of the concave portion is connected to the connection electrode (15) at the top surface by a penetration electrode (22) inside a multilayer substrate. By such a configuration, the semiconductor chip (4) is connected to the antenna (3).