POLYAMIDEIMIDE ADHESIVES FOR PRINTED CIRCUIT BOARDS
摘要
<p>The present invention relates to curable, liquid, adhesive compositions comprising polyamideimide resins for use in bonding layers of material in metal clad laminate materials for electronic components, such as flexible circuit boards. In particular, the invention relates to liquid adhesive compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.</p>
申请公布号
WO2011051412(A1)
申请公布日期
2011.05.05
申请号
WO2010EP66411
申请日期
2010.10.28
申请人
SUN CHEMICAL B.V.;DAVIS, RICHARD, CHARLES;FORD, SIMON, RICHARD;HALL, STEPHEN, ANTHONY;KLAUS, MATTHIAS;OGNIBENI, KARL-HEINZ
