发明名称 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
摘要 A plasma processing apparatus includes a processing chamber including a dielectric window; a coil shaped RF antenna provided outside the dielectric window; a substrate supporting unit, provided in the processing chamber, for mounting thereon a target substrate to be processed; a processing gas supply unit for supplying a desired processing gas to the processing chamber to perform a desired plasma process on the target substrate; and an RF power supply unit for supplying an RF power to the RF antenna to generate a plasma of the processing gas by an inductive coupling in the processing chamber. The apparatus further includes a floating coil electrically floated and arranged at a position outside the processing chamber where the floating coil is to be coupled with the RF antenna by an electromagnetic induction; and a capacitor provided in a loop of the floating coil.
申请公布号 US2011104902(A1) 申请公布日期 2011.05.05
申请号 US20100913441 申请日期 2010.10.27
申请人 TOKYO ELECTRON LIMITED 发明人 YAMAZAWA YOHEI;KOSHIMIZU CHISHIO;DENPOH KAZUKI;YAMAWAKU JUN;SAITO MASASHI
分类号 H01L21/3065;C23C14/34;C23C16/505;H01L21/30 主分类号 H01L21/3065
代理机构 代理人
主权项
地址