发明名称 CYLINDRICAL SPUTTERING TARGET AND PROCESS FOR PRODUCING THE SAME
摘要 Provided is a cylindrical ceramic sputtering target, which significantly reduces the occurrence of a crack, a chip, extraordinary discharge and a nodule. By filling a molten bonding material in a cavity defined by a cylindrical ceramic target material and a cylindrical base material, starting cooling the molten bonding material from its one end toward its other end in a cylindrical axial direction in sequence, and further filling the molten bonding material in the cavity during cooling, a cylindrical ceramic sputtering target is manufactured so as to be characterized in that as observed by an X-ray radiograph of the bonding material, the total area of portions where no bonding material exists is 10 cm2 or less per 50 cm2 of X-ray radiograph area, and the maximum area of the portions where no bonding material exists is 9 cm2 or less.
申请公布号 US2011100808(A1) 申请公布日期 2011.05.05
申请号 US20090997043 申请日期 2009.06.09
申请人 TOSOH CORPORATION 发明人 TODOKO SHIGEHISA;TAMANO KIMIAKI;ITOH KENICHI;SHIBUTAMI TETSUO
分类号 C23C14/06;B29C71/00;C23C14/34 主分类号 C23C14/06
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