ELEMENT MOUNTING SUBSTRATE, SEMICONDUCTOR MODULE, AND PORTABLE APPARATUS

摘要

Disclosed is an element mounting substrate (110) which is provided with: a base material (10); an insulating layer (30), which is provided on one main surface of the base material (10), and has an opening (32) having an electrode forming region on the base material (10) exposed therefrom; and an electrode pad (22) provided in the opening (32). The insulating layer (30) has a multilayer structure wherein a plurality of layer-like insulating bodies (33, 34, 35) are laminated, the layer-like insulating bodies (33, 34, 35) are configured such that the lower end portion of the opening in the upper layer-like insulating body is positioned on the main surface of the periphery of the opening in the lower layer-like insulating body, and the electrode pad (22) is configured such that the top surface thereof is positioned higher than the lower main surface of the layer-like insulating body (35) of the topmost layer.